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US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Semiconductor structure with nitrided inner spacers and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,679, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure with ni... Read More


US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,680, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device and method of fabricati... Read More


US Patent Issued to UNITED MICROELECTRONICS on June 23 for "Semiconductor structure and fabricating method of the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,681, issued on June 23, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor structure and fabricating met... Read More


US Patent Issued to International Business Machines on June 23 for "Vertical transport transistor devices with back side interconnects" (New York, New Hampshire, Vermont Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,682, issued on June 23, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Vertical transport transistor devices with b... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Semiconductor device with reduced leakage" (Japanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,683, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device with reduc... Read More


US Patent Issued to Fujian Jinhua Integrated Circuit on June 23 for "Semiconductor device and method of fabricating the same" (Chinese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,684, issued on June 23, was assigned to Fujian Jinhua Integrated Circuit Co. Ltd. (Quanzhou City, China). "Semiconductor device and method ... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Triple layer high-k gate dielectric stack for workfunction engineering" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,685, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Triple layer high-k gate dielectric... Read More


US Patent Issued to UNITED MICROELECTRONICS on June 23 for "Semiconductor structure with flush shallow trench isolation and gate oxide and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,686, issued on June 23, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor structure with flush shallow ... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Field effect transistor with gate electrode having multiple gate lengths" (Taiwanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,687, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Field effect transistor with gate e... Read More


US Patent Issued to Intel on June 23 for "Low resistance metal to semiconductor contacts for integrated NMOS and PMOS transistors" (Oregon Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,688, issued on June 23, was assigned to Intel Corp. (Santa Clara, Calif.). "Low resistance metal to semiconductor contacts for integrated N... Read More